Specific Process Knowledge/Thermal Process/Jipelec RTP: Difference between revisions

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Jipelec - Rapid Thermal Processing

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The Jipelec is a rapid thermal processing oven. It should be used for fast and well-controlled annealing or alloying of samples. It is possible to use a pyrometer to control the temperature (of the carrier).

The user manual(s), technical information and contact information can be found in LabManager:

Jipelec RTP

Overview of the performance of the Jipelec RTP and some process related parameters

Purpose		RTP annealing
Process parameter range	Process Temperature	0-1000 ^oC Temperature ramp up to 300 ^oC/min
	Process pressure	1 atm vacuum
	Gasses on the system	N₂
Substrates	Batch size	1 4" wafer (or 2" wafers) per run Small samples
Substrates	Substrate material allowed	A silicon carrier wafer with 1 µm oxide is always need (except for III-V materials) Silicon Silicon oxides Silicon nitrides Quartz Polysilicon Titan III-V materials (on graphite carrier) Silicon wafers (new from the box or RCA cleaned) In doubt: look at the cross contamination chart or send a mail to the Furnace group.

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	[[Image:RTP_oven.jpg\|300x300px\|thumb\|Jipelec RTP: Positioned in cleanroom 1]]		[[Image:RTP_oven.jpg\|300x300px\|thumb\|Jipelec RTP: Positioned in cleanroom 1]]