Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions
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sputtering. The materials available currently are: | sputtering. The materials available currently are: | ||
*TiW alloy (10%/90% by weight) | *[[Specific Process Knowledge/Thin film deposition/Deposition of TiW|TiW]] alloy (10%/90% by weight) | ||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|Aluminium (Al)]] | *[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|Aluminium (Al)]] | ||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Chromium|Chromium (Cr)]] | *[[Specific Process Knowledge/Thin film deposition/Deposition of Chromium|Chromium (Cr)]] | ||