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| Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Both tracks have a HMDS priming module, a spin coater, and a hotplate. In fack, the only difference between the two tracks is the resist used in the spin coating. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafets, but is currently set up for 100 mm wafer processing.
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| '''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=293 LabManager]''' | | '''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=293 LabManager]''' |
| <!-- remember to remove the type of documents that are not present --> | | <!-- remember to remove the type of documents that are not present --> |
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| ===Process information===
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| Link to process pages - e.g. one page for each material
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| Example:
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| *[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Etch of silicon using RIE]]
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| *[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]]
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| *[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]]
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| *[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of photo resist using RIE]]
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| === Equipment performance and process related parameters ===
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| {| border="2" cellspacing="0" cellpadding="2"
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| !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
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| |style="background:WhiteSmoke; color:black"|<b>Equipment 1</b>
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| |style="background:WhiteSmoke; color:black"|<b>Equipment 2</b>
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| |-
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| !style="background:silver; color:black;" align="center" width="60"|Purpose
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| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black"|
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| *Purpose 1
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| *Purpose 2
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| |style="background:WhiteSmoke; color:black"|
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| *Purpose 1
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| *Purpose 2
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| *Purpose 3
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
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| |style="background:LightGrey; color:black"|Response 1
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| |style="background:WhiteSmoke; color:black"|
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| *Performance range 1
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| *Performance range 2
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| |style="background:WhiteSmoke; color:black"|
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| *Performance range 1
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| *Performance range 2
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| *Performance range 3
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| |-
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| |style="background:LightGrey; color:black"|Response 2
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| |style="background:WhiteSmoke; color:black"|
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| *Performance range
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| |style="background:WhiteSmoke; color:black"|
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| *Performance range
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
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| |style="background:LightGrey; color:black"|Parameter 1
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| |style="background:WhiteSmoke; color:black"|
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| *Range
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| |style="background:WhiteSmoke; color:black"|
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| *Range
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| |-
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| |style="background:LightGrey; color:black"|Parameter 2
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| |style="background:WhiteSmoke; color:black"|
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| *Range
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| |style="background:WhiteSmoke; color:black"|
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| *Range
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| |-
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| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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| |style="background:LightGrey; color:black"|Batch size
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| |style="background:WhiteSmoke; color:black"|
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| *<nowiki>#</nowiki> small samples
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| *<nowiki>#</nowiki> 50 mm wafers
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| *<nowiki>#</nowiki> 100 mm wafers
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| *<nowiki>#</nowiki> 150 mm wafers
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| |style="background:WhiteSmoke; color:black"|
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| *<nowiki>#</nowiki> small samples
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| *<nowiki>#</nowiki> 50 mm wafers
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| *<nowiki>#</nowiki> 100 mm wafers
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| *<nowiki>#</nowiki> 150 mm wafers
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| |-
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| | style="background:LightGrey; color:black"|Allowed materials
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| |style="background:WhiteSmoke; color:black"|
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| *Allowed material 1
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| *Allowed material 2
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| |style="background:WhiteSmoke; color:black"|
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| *Allowed material 1
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| *Allowed material 2
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| *Allowed material 3
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| |-
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| |}
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| <br clear="all" /> | | <br clear="all" /> |
