Specific Process Knowledge/Lithography/Coaters: Difference between revisions

← Older edit Newer edit →

VisualWikitext

@@ Line 20: / Line 20: @@
 **E-beam resist
 |style="background:WhiteSmoke; color:black"|
-*Coating baking of
+*Coating and baking of
 **AZ5214E resist
 **AZ4562 resist
@@ Line 30: / Line 30: @@
 **AZ nLOF 2020 resist
 *Post-exposure baking at 110°C
-|
+|style="background:WhiteSmoke; color:black"|
-|
+*Coating of all resist
+|style="background:WhiteSmoke; color:black"|
+*Coating of
+** UV sensetive resist
+** E-beam resist
 |style="background:WhiteSmoke; color:black"|
 *Spraying imprint resist
@@ Line 86: / Line 90: @@
 |style="background:LightGrey; color:black"|Spindle speed
 |style="background:WhiteSmoke; color:black"|
-*Range
+*100-5000 rpm
 |style="background:WhiteSmoke; color:black"|
-*Range
+*100-5000 rpm
 |style="background:WhiteSmoke; color:black"|
 *10 - 9990 rpm
-|
+|style="background:WhiteSmoke; color:black"|
-|
+*100-5000 rpm
+|style="background:WhiteSmoke; color:black"|
 *10-5000 rpm
 |style="background:WhiteSmoke; color:black"|
 |-
-|style="background:LightGrey; color:black"|Parameter 2
+|style="background:LightGrey; color:black"|Gyrset
+|style="background:WhiteSmoke; color:black"|
+*optinal
+|style="background:WhiteSmoke; color:black"|
+*optinal
 |style="background:WhiteSmoke; color:black"|
-*Range
+*no
 |style="background:WhiteSmoke; color:black"|
-*Range
+*no
 |style="background:WhiteSmoke; color:black"|
-*Range
+*no
-|
-|
 |style="background:WhiteSmoke; color:black"|
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
+|style="background:LightGrey; color:black"|Substrate  size
+|style="background:WhiteSmoke; color:black"|
+*50 mm wafers
+*100 mm wafers
+*150 mm wafers
+|style="background:WhiteSmoke; color:black"|
+*100 mm wafer
+*150 mm wafer
+|style="background:WhiteSmoke; color:black"|
+*100 mm wafers
+*150 mm wafer
+|style="background:WhiteSmoke; color:black"|
+*50 mm wafers
+*100 mm wafers
+*150 mm wafer
+*small pieces down to 10x10 mm2
+|style="background:WhiteSmoke; color:black"|
+*50 mm wafers
+*100 mm wafers
+*150 mm wafer
+*small pieces down to 3x3 mm2
+|style="background:WhiteSmoke; color:black"|
+*Any sample(s) that fit inside machine
+|-
 |style="background:LightGrey; color:black"|Batch size
 |style="background:WhiteSmoke; color:black"|
-*<nowiki>24</nowiki> 50 mm wafers
+*1-24
-*<nowiki>24</nowiki> 100 mm wafers
-*<nowiki>24</nowiki> 150 mm wafers
 |style="background:WhiteSmoke; color:black"|
-*<nowiki>1</nowiki> 100 mm wafer
+*1
-*<nowiki>1</nowiki> 150 mm wafer
 |style="background:WhiteSmoke; color:black"|
-*<nowiki>25</nowiki> 100 mm wafers
+*1-25
-|
-|
-* Substrate size:
-** 3x3 mm2 - 6"
-** Max 4 mm thick
 |style="background:WhiteSmoke; color:black"|
-*Any sample(s) that fit inside machine
+*1
+|style="background:WhiteSmoke; color:black"|
+*1
+|style="background:WhiteSmoke; color:black"|
+*1
 |-
 | style="background:LightGrey; color:black"|Allowed materials
 |style="background:WhiteSmoke; color:black"|
-*Allowed material 1
+*All cleanroom materials except III-V materials
-*Allowed material 2
 |style="background:WhiteSmoke; color:black"|
-*Allowed material 1
+*All cleanroom materials except III-V materials
-*Allowed material 2
-*Allowed material 3
 |style="background:WhiteSmoke; color:black"|
 *Silicon
 *Glass
-|
+|style="background:WhiteSmoke; color:black"|
-|
+*All cleanroom materials except III-V materials
+|style="background:WhiteSmoke; color:black"|
 *III-V materials
 *Si, SiO2, SOI