Specific Process Knowledge/Etch/KOH Etch: Difference between revisions
| Line 73: | Line 73: | ||
*0.4 µm/min (60 °C) | *0.4 µm/min (60 °C) | ||
*1.3 µm/min (80 °C) | *1.3 µm/min (80 °C) | ||
Etch rates might vary due to contamination of KOH | Etch rates might vary due to contamination and poor controlled concentration of the KOH solution | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Somewhat lower than in the dedicated baths. Approximately 1 µm/min @ 80 °C in 28 wt% | *Somewhat lower than in the dedicated baths. Approximately 1 µm/min @ 80 °C in 28 wt% | ||
| Line 95: | Line 95: | ||
*Typical: 100-600 Å | *Typical: 100-600 Å | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*May be high due to contamination and poor controlled concentration of | *May be high due to contamination and poor controlled concentration of the KOH solution | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Typical worse than KOH2 and KOH3 | *Typical worse than KOH2 and KOH3 | ||
| Line 119: | Line 119: | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*28 wt% mixed in the ratio | *28 wt% mixed in the ratio | ||
KOH:H<sub>2</sub>O | KOH:H<sub>2</sub>O - 500 g : 1000 ml | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Custom made | *Custom made | ||
| Line 129: | Line 129: | ||
*Max 80 °C (standard etch) | *Max 80 °C (standard etch) | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Max | *Max 80 °C | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Max 80 °C | *Max 80 °C | ||