Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
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|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
! | ! | ||
! BHF clean in Cleanroom3 | |||
! BHF in Cleanroom3 (KOH bench 1+2) | ! BHF in Cleanroom3 (KOH bench 1+2) | ||
! BHF in Cleanroom4 (KOH bench 6”) | ! BHF in Cleanroom4 (KOH bench 6”) | ||
! BHF in RCA Bench | ! BHF in RCA Bench | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Restrictions | !Restrictions | ||
|No wafers with metal are allowed in this bath | |||
|Wafers have to be cleaned in 7UP or RCA before further processing. | |Wafers have to be cleaned in 7UP or RCA before further processing. | ||
|Wafers have to be cleaned in 7UP or RCA before further processing. | |Wafers have to be cleaned in 7UP or RCA before further processing. | ||
|Only for wafers with phosphor glass or boron glass that comes directly from one of the furnaces in stack A. All other substrates and material are strictly forbidden to go into the tank. | |Only for wafers with phosphor glass or boron glass that comes directly from one of the furnaces in stack A. All other substrates and material are strictly forbidden to go into the tank. | ||