Specific Process Knowledge/Lithography/UVLithography

UV Lithography uses ultraviolet light to transfer a pattern from a mask to a wafer coated with photoresist. The photoresist film is spin coated on the wafers and the pattern is transferred to the wafer by using a mask aligner. DTU Danchip houses a number of automatic or semi-automatic coaters and mask aligners.

Resist Overview

Resist	Polarity	Manufacturer	Comments	Technical reports	Spin Coating	Developer	Rinse	Remover	Process flows (in docx-format)
AZ5214E	Positive	AZ Electronic Materials	Can be used for both positive and reverse processes with resist thickness between 1 to 4um.	AZ5214E.pdf‎	SSE, KS Spinner, III-V Spinner	351B developer	DI water	Acetone
AZ4562	Positive	AZ Electronic Materials	For process with resist thickness between 6 and 25um.	AZ4500.pdf‎	SSE, KS Spinner	351B developer	DI water	Acetone
AZ MiR 701	Positive	AZ Electronic Materials	High selectivity for dry etch.	AZ_MiR_701.pdf‎	Spin Track 1 + 2	AZ 726 MIF developer	DI water	Remover 1165	Process_Flow_AZ_MiR701.docx‎
AZ nLOF 2020	Negative	AZ Electronic Materials		AZ_nLOF_2020.pdf‎	Spin Track 1 + 2	AZ 726 MIF developer	DI water	Remover 1165	Process_Flow_AZ_nLOF_2020.docx‎
SU8	Negative	[1]			KS Spinner				Process_Flow_SU8_70um.docx‎

UV Lithography Equipment

Pretreatment HMDS BHF 250C Oven for Pretreatment Coaters SSE Spinner Spin Track 1 + 2 KS Spinner Manual Spinner (Polymers) Manual Spinner 1 (Laurell) III-V Spinner Spray Coater UV Exposure KS Aligner EVG Aligner III-V Aligner Inclined UV lamp	Baking Hotplates Ovens Development Strip Plasma Asher 1 Plasma Asher 2 III-V Plasma Asher Rough Acetone Strip Fine Acetone Strip Lift-off Lift-off Wet Bench Lift-off (4", 6") Wafer Cleaning