Jump to content

Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions

Bghe (talk | contribs)
No edit summary
Kabi (talk | contribs)
No edit summary
Line 9: Line 9:
<!-- remember to remove the type of documents that are not present -->
<!-- remember to remove the type of documents that are not present -->


[[Image:TPTWireBonder.jpg|300x300px|thumb|TPT Wire Bonder, Packlab, Building 347, 2nd floor]]
[[Image:TPT-wirebonder.jpg|300x300px|thumb|TPT Wire Bonder, Packlab, Building 347, 2nd floor]]
[[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]]
[[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]]