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Specific Process Knowledge/Lithography/UVLithography: Difference between revisions

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Elkh (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
343 edits
Elkh (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
343 edits
Line 20: Line 20:
|'''Technical reports'''
|'''Technical reports'''
|'''[[Specific_Process_Knowledge/Lithography/Coaters|Spin Coating]]'''
|'''[[Specific_Process_Knowledge/Lithography/Coaters|Spin Coating]]'''
|'''[[Specific_Process_Knowledge/Lithography/Development|Development]]'''
|'''[[Specific_Process_Knowledge/Lithography/Development|Developer]]'''
|'''Rinse'''
|'''Rinse'''
|'''Remover'''
|'''Remover'''
Line 31: Line 31:
|'''AZ5214E'''
|'''AZ5214E'''
|Positive
|Positive
|
|AZ Electronic Materials
|
|Can be used for both positive and reverse processes with resist thickness between 1 to 4um.
|[[media:AZ5214E.pdf‎|AZ5214E.pdf‎]]
|[[media:AZ5214E.pdf‎|AZ5214E.pdf‎]]
|[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE]], [[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]], [[Specific_Process_Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]
|[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE]], [[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]], [[Specific_Process_Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]
|
|351B developer
|
|DI water
|
|Acetone
|
|


Line 45: Line 45:
|'''AZ4562'''
|'''AZ4562'''
|Positive
|Positive
|
|AZ Electronic Materials
|  
|For process with resist thickness between 6 and 25um.
|[[media:AZ4500.pdf‎|AZ4500.pdf‎]]
|[[media:AZ4500.pdf‎|AZ4500.pdf‎]]
|[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE]], [[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]]
|[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE]], [[Specific_Process_Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]]
|
|351B developer
|
|DI water
|
|Acetone
|
|


Line 58: Line 58:
|'''AZ MiR 701'''
|'''AZ MiR 701'''
|Positive
|Positive
|
|AZ Electronic Materials
|
|High selectivity for dry etch.
|[[media:AZ_MiR_701.pdf‎|AZ_MiR_701.pdf‎]]
|[[media:AZ_MiR_701.pdf‎|AZ_MiR_701.pdf‎]]
|[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]  
|[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]  
|
|AZ 726 MIF developer
|
|DI water
|
|Remover 1165
|[[media:Process_Flow_AZ_MiR701.docx‎|Process_Flow_AZ_MiR701.docx‎]]
|[[media:Process_Flow_AZ_MiR701.docx‎|Process_Flow_AZ_MiR701.docx‎]]


Line 71: Line 71:
|'''AZ nLOF 2020'''
|'''AZ nLOF 2020'''
|Negative
|Negative
|
|AZ Electronic Materials
|
|
|[[media:AZ_nLOF_2020.pdf‎|AZ_nLOF_2020.pdf‎]]
|[[media:AZ_nLOF_2020.pdf‎|AZ_nLOF_2020.pdf‎]]
|[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]
|[[Specific_Process_Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]]
|
|AZ 726 MIF developer
|
|DI water
|
|Remover 1165
|[[media:Process_Flow_AZ_nLOF_2020.docx‎|Process_Flow_AZ_nLOF_2020.docx‎]]
|[[media:Process_Flow_AZ_nLOF_2020.docx‎|Process_Flow_AZ_nLOF_2020.docx‎]]


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