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Specific Process Knowledge/Etch/KOH Etch: Difference between revisions

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image:KOH3_RR4_1.JPG|KOH etch for 4" and 6" wafers. Positioned in cleanroom 4.  
image:KOH3_RR4_1.JPG|KOH etch for 4" and 6" wafers. Positioned in cleanroom 4.  
image:KOH_4tommer.jpg|KOH etch for 4" wafers. KOH1 to the left and KOH2 to the right, in between you find the BHF tank. Positioned in cleanroom 3.  
image:KOH_4tommer.jpg|KOH etch for 4" wafers. KOH1 to the left and KOH2 to the right, in between you find the BHF tank. Positioned in cleanroom 3.  
image:Stinkskab RR2.jpg|PP-bath: positioned in the upper right corner of the fumehood in cleanroom 2. </gallery>
image:KOH_fumehood.JPG|KOH_fumehood is positioned in cleanroom 2. This is used for wafers that is considered dirty.</gallery>


Key facts for the different etch baths available at Danchip are resumed in the table:
Key facts for the different etch baths available at Danchip are resumed in the table: