Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | |||
|- | |- | ||
| Batch size | | Batch size | ||
| Line 20: | Line 21: | ||
*6x4" wafers or | *6x4" wafers or | ||
*6x6" wafers | *6x6" wafers | ||
| | |||
*1x4" wafer or | |||
*1x6" wafer | |||
*smaller pieces | |||
|- | |- | ||
| Pre-clean | | Pre-clean | ||
|RF Ar clean | |||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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| Layer thickness | | Layer thickness | ||
|10Å to 5000Å | |10Å to 5000Å | ||
|10Å to 5000Å | |||
|10Å to 5000Å | |10Å to 5000Å | ||
|- | |- | ||
| Line 32: | Line 39: | ||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
|? Å/s to ? Å/s | |||
|- | |- | ||
|} | |} | ||
Revision as of 11:54, 10 September 2013
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Platinum deposition
Platinum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | Sputter deposition (Lesker) | |
|---|---|---|---|
| Batch size |
|
|
|
| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 5000Å | 10Å to 5000Å | 10Å to 5000Å |
| Deposition rate | 2Å/s to 15Å/s | 10Å/s to 15Å/s | ? Å/s to ? Å/s |