Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
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This shows the interior of the tool with optics, scannerheads and stage. | This shows the interior of the tool with optics, scannerheads and stage. | ||
[[File:Laser_Micromachining_Tool_stage_room_details.jpg|400px|thumb|Inside lasertool]] | [[File:Laser_Micromachining_Tool_stage_room_details.jpg|400px|thumb|Inside lasertool]] | ||
== Process information == | |||
*[[Specific Process Knowledge/Back-end processing/Silicon dicing-milling|Silicon dicing and milling]] | *[[Specific Process Knowledge/Back-end processing/Silicon dicing-milling|Silicon dicing and milling]] | ||
Revision as of 11:02, 5 September 2013
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Laser Micromachining Tool 
The Laser Micromachining Tool is a microSTRUCT vario from the company 3D-Micromac AG.
It is currently only for internal use by Danchip personel for training. It will be public available some time during the first half year of 2013.
The system is able to produce micro structures in different kinds of materials like metals, ceramics, composite materials, etc.
The machine is located in the basement of building 346 under the cleanroom.
The user manual(s), user APV(s), technical information and contact information can be found in LabManager:
The Laser Micromachining Tool in LabManager
It is equipped with 2 high power lasers:
- a 50W picosecond laser that can emit light at 3 wavelengths: 355nm, 532nm and 1064nm and a
- a 100W nanosecond laser with a wavelength of 1064nm.
It consist of these main parts:
- Upper service way
- Manual front door
- Operating panel
- Machine's feet (adjustable)
- Left service way
- Electrical cabinet
This shows the interior of the tool with optics, scannerheads and stage.
