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[[image:IBE acceptance S18-AU-ZEP5.jpg|450x450px|thumb|center|s18-Au-ZEP5]]
[[image:IBE acceptance S18-AU-ZEP5.jpg|450x450px|thumb|center|s18-Au-ZEP5]]
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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=




==IBE Au etch with Ti mask==
==IBE Au etch with Ti mask==
Work has been started to find a good process for etching gold with a Titanium mask with high selektivity.
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![[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Method 1]]
![[Specific Process Knowledge/Thin film deposition/PECVD|Method 2]]
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!Generel description
|Generel description - method 1
|Generel description - method 2
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!Parameter 1
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*A
*B
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*A
*B
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!Parameter 2
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*A
*B
*C
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*A
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!Substrate size
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*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
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*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
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!'''Allowed materials'''
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*Allowed material 1
*Allowed material 2
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*Allowed material 1
*Allowed material 2
*Allowed material 3
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