Revision as of 14:07, 21 August 2013

UV Lithography uses ultraviolet light to transfer a pattern from a mask to a wafer coated with photoresist. The photoresist film is spin coated on the wafers and the pattern is transferred to the wafer by using a mask aligner. DTU Danchip houses a number of automatic or semi-automatic coaters and mask aligners.

Resist Overview

Resist	Polarity	Manufacturer	Comments	Technical reports	Spin Coating	Development	Rinse	Remover	Process flows (in docx-format)
AZ5214E	Positive			AZ5214E.pdf‎	SSE, KS Spinner, III-V Spinner
AZ4562	Positive			AZ4500.pdf‎	SSE, KS Spinner
AZ MiR 701	Positive			AZ_MiR_701.pdf‎	Spin Track 1 + 2				Process_Flow_AZ_MiR701.docx‎
AZ nLOF 2020	Negative			AZ_nLOF_2020.pdf‎	Spin Track 1 + 2				Process_Flow_AZ_nLOF_2020.docx‎
SU8	Positive				KS Spinner

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 = Resist Overview =