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| | | UV Lithography uses ultraviolet light to transfer a pattern from a mask to a wafer coated with photoresist. The photoresist film is spin coated on the wafers and the pattern is transferred to the wafer by using a mask aligner. DTU Danchip houses a number of automatic or semi-automatic coaters and mask aligners. |
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| ![[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Process]]
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| ![[Specific Process Knowledge/Thin film deposition/PECVD|Resist Type]]
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| ![[Specific Process Knowledge/Thin film deposition/PECVD|Comment 1]]
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| ![[Specific Process Knowledge/Thin film deposition/PECVD|Comment 2]]
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| ![[Specific Process Knowledge/Thin film deposition/PECVD|Comment 3]]
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| |II
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