Specific Process Knowledge/Back-end processing: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]''' | |||
== Choose an equipment == | == Choose an equipment == | ||
Revision as of 07:45, 21 August 2013
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Choose an equipment
- Die Bonder (eutectic metal)
- Flip-chip Bonder (glue)
- TPT Wire Bonder
- Ball Wire Bonder
- Wafer Scriber
- Disco Saw
- Polymer Injection Molder
- Polisher/Lapper machine
- Laser Micromachining Tool
- Sandblasting (at DTU Nanotech). Sandblasting is a very fast way of structuring glass and can be used for e.g. making inlet holes in glass substrates for microfluidic devices