Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
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|All materials | |All materials | ||
|All materials | |All materials | ||
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===SiO etching bath=== | |||
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" | |||
|- | |||
|-style="background:silver; color:black" | |||
! | |||
! SiO tank | |||
|- | |||
|-style="background:WhiteSmoke; color:black" | |||
!Batch size! | |||
|1-25 wafers at a time | |||
|- | |||
|-style="background:LightGrey; color:black" | |||
!Size of substrate | |||
|4" wafers | |||
|- | |||
|-style="background:WhiteSmoke; color:black" | |||
!Allowed materials | |||
| | |||
*Silicon | |||
*Poly silicon | |||
*Silicon nitrides | |||
*Silicon oxynitrides | |||
*Silicon oxides | |||
*Photoresist | |||
|- | |- | ||
|} | |} | ||