Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions

@@ Line 368: / Line 368: @@
 |
 *All materials
+|-
+|-style="background:LightGrey; color:black"
+!Restrictions
+|Wafers have to be cleaned in 7UP or RCA before further processing.
+|No wafers with metal are allowed in this bath
+|Wafers have to be cleaned in 7UP or RCA before further processing.
+|Only for wafers with phosphor glass or boron glass that comes directly from one of the furnaces in stack A.
+|None
+|None
+|-
+|}
+===Comparing different HF baths===
+{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
+|-
+|-style="background:silver; color:black"
+!
+! 5% HF in RCA Bench
+! 5% HF PP-bath
+! 5% HF Plastic beaker
+|-
+|-style="background:WhiteSmoke; color:black"
+!Batch size!
+|1-25 wafers at a time
+|1-25 wafer at a time
+|1-7 wafers at a time
+|-
+|-style="background:LightGrey; color:black"
+!Size of substrate
+|2"-6" wafers
+|2"-6" wafers
+|2"- 4" wafers or any that fits in a dedicated holder
+|-
+|-style="background:WhiteSmoke; color:black"
+!Allowed materials
+|Only for wafers that are being RCA cleaned
+|All materials
+|All materials
+|
 |-
 |-style="background:LightGrey; color:black"