Specific Process Knowledge/Etch/KOH Etch: Difference between revisions

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 |style="background:WhiteSmoke; color:black"|<b>KOH3</b>
 |style="background:WhiteSmoke; color:black"|<b>KOH2</b>
+|style="background:WhiteSmoke; color:black"|<b>KOH1</b>
+|style="background:WhiteSmoke; color:black"|<b>KOH Fumehood</b>
 |-
 !style="background:silver; color:black;" align="center" width="60"|Purpose
-|style="background:LightGrey; color:black"|Wet etch of
+|style="background:LightGrey; color:black"|Wet etch of Silicon
 |style="background:WhiteSmoke; color:black"|
-*Silicon
+*Etch of Silicon in 28 wt% KOH
-*Silicon oxide
-*Silicon (oxy)nitride
-*Resist
 |style="background:WhiteSmoke; color:black"|
-*Silicon
+*Etch of Silicon in 28 wt% KOH
-*Silicon oxide
+|style="background:WhiteSmoke; color:black"|
-*Silicon (oxy)nitride
+*Etch of Silicon in 28 wt% KOH saturated with IPA
-*Resist and other polymers
+|style="background:WhiteSmoke; color:black"|
+*Etch of Silicon in user mixed KOH
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance