Specific Process Knowledge/Lithography/Coaters: Difference between revisions

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 |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Manual Spinner 1 (Laurell)|Manual Spinner 1]]</b>
 |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]</b>
+|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spray Coater|Spray Coater]]</b>
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 !style="background:silver; width:100px; color:black;" align="center"|Purpose
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 **AZ nLOF 2020 resist
 *Post-exposure baking at 110°C
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 * PGMEA for spinner bowl cleaning and vapor tip bath
 |colspan="2" rowspan="2" align="center"|Only manual dispense
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 |style="background:WhiteSmoke; color:black"|
 * no
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 |style="background:WhiteSmoke; color:black"|
 *Range
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 * Minimum substrate size: 3*3 mm2
 * maximum substrate thickness: 4 mm
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 | style="background:LightGrey; color:black"|Allowed materials
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 *III-V compound semiconductors
 *Si, SiO2, SOI
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 |}