Jump to content

Specific Process Knowledge/Lithography/Coaters: Difference between revisions

Tigre (talk | contribs)
Tigre (talk | contribs)
Line 248: Line 248:


==III-V Spinner==
==III-V Spinner==
[[Image:Opticoat.jpg|200×200px|right|thumb|The Manual Spinner(Polymers) is placed in fumehood in Cleanroom 3.]]
The III-V spinner is a SÜSS RC8 Spin Coater intended for processing of III-V compound semiconductors and CMOS compatible materals. Please note, that '''there are different chucks for III-V materials and CMOS compatible materials.''' The spinner is mounted in a laminar flow hood located in the III-V laboratory (yellow room).


A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here. A lot of text here. A lot of text here. A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here. A lot of text here. A lot of text here.
[[Image:3-5 spinner.jpg|300x300px|thumb|III-V Aligner positioned in III-V cleanroom ]]
A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here. A lot of text here. A lot of text here. A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here. A lot of text here. A lot of text here.


A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here. A lot of text here. A lot of text here. A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here. A lot of text here. A lot of text here.
 
A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here. A lot of text here. A lot of text here. A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here.  A lot of text here. A lot of text here. A lot of text here.
{| border="2" cellspacing="0" cellpadding="10"
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="4"|Performance
|style="background:LightGrey; color:black"|Maximum speed
|style="background:WhiteSmoke; color:black"|
*Cover closed: 7000 rpm
*Cover open: 1000 rpm
* Gyrset: 3000 rpm
* non-vaccum chuck: 5000 rpm
|-
|style="background:LightGrey; color:black"|Maximum acceleration
|style="background:WhiteSmoke; color:black"|
*5000 rpm/s
|-
| style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
* Maximum substrate size: 6"
* Minimum substrate size: 3*3 mm2
* maximum substrate thickness: 4 mm
|-
| style="background:LightGrey; color:black"|Allowed Substrate material
|style="background:WhiteSmoke; color:black"|
*III-V compound semiconductors
*CMOS compatible materials
|-
|}