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Specific Process Knowledge/Wafer cleaning: Difference between revisions

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== Clean with: ==
== Clean with: ==


*RCA - ''two step process to remove organics and metals''
*[[Cleaning with RCA|RCA]] - ''Two step process to remove organics and metals''
*7-up - ''piranha etch of wafers and masks - removes organiscs and alkali ions''
*[[Cleaning with 7-up|7-up]] - ''Fake piranha etch of wafers and masks - removes organics and alkali ions''
*BHF - ''etching of predep glass''
*[[Cleaning with Piranha|Piranha]] - ''Removes organics and alkali ions''
*[[Cleaning with BHF|BHF]] - ''Removing native oxide, etching of predep glass etc.''
*[[Cleaning with IMEC|IMEC]] - ''Cleaning before fusion bonding''
*[[Cleaning with Soap Sonic|Soap Sonic]] - ''Cleaning of "dirty" wafers when entering the cleanroom''
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