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| = Process Flows = | | = Process Flows = |
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| ZEP520A is used as a standard positive e-beam resist. A process flow for spinning, e-beam exposing and development of this resist can be downloaded here (word format):
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| [[media:Process_Flow_ZEP.docx|Process_Flow_ZEP.docx]]; please note that the individual steps of the process flow should be optimised to your specific processing technique, this process flow thus being a guideline.
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| You can use the SSE-spinner, the Manual Spinner 1 or the III-V spinner to coat wafer or chips with e-beam resist. Read more about these spinners
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| <span class="plainlinks">[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters here]</span> (opens in a new tab).
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|
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| * ZEP520A (standard resist), FLOW
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| * table of available resists
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| {|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" width="80%"
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| |-
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| |-
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| |-style="background:silver; color:black"
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| |'''Resist'''
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| |'''ZEP520A'''
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| |'''ZEP7000'''
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| |'''PMMA'''
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| |'''MMA (AR-P 617.05)'''
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| |'''CSAR'''
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| |'''HSQ/XR-1541'''
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| |'''Ma-N 2403'''
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| |'''Mr EBL 6000'''
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| |-
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| |-
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| |-style="background:WhiteSmoke; color:black"
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| |'''Polarity'''
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| |Positive
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| |Positive
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| |Positive
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| |Positive
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| |Positive
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| |Negative
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| |Negative
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| |Negative
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| |-
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| |-style="background:LightGrey; color:black"
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| |'''Manufacturer'''
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| |ZEON
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| |ZEON
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| |AllResist
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| |AllResist
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| |DOW Corning
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| |Micro Resist
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| |Micro Resist
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| |-
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| |-style="background:WhiteSmoke; color:black"
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| |'''Comments'''
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| |Standard positive resist.
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| |Low dose to clear. Used for trilayer (PEC-free) resist-stack. Please contact Lithography.
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| |Approved, not tested yet. Used for trilayer (PEC-free) resist-stack or double-layer lift-off resist stack.
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| |Approved, not tested yet. Should work quite similar as ZEP520A. Please contact Lithography.
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| |Approved, not tested yet.
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| |Standard negative resist
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| |-
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| |-style="background:WhiteSmoke; color:black"
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| |'''Technical Report'''
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| |[[media:ZEP520A.pdf|ZEP520A.pdf]]
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| |[[media:ZEP7000.pdf|ZEP7000.pdf]]
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| |[[media:AR_P617.pdf|AR_P617.pdf]]
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| |[[media:CSAR_62_and_process_chemicals.pdf|CSAR_62_and_process_chemicals.pdf]]
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| |-
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| |-style="background:LightGrey; color:black"
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| |'''Spinner'''
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| |SSE, Manual Spinner 1, III-V Spinner
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| |Manual Spinner 1, III-V spinner
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| |Manual Spinner 1, III-V spinner
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| |Manual Spinner 1, III-V spinner
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| |Manual Spinner 1, III-V spinner
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| |Manual Spinner 1, III-V spinner
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| |Manual Spinner 1, III-V spinner
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| |Manual Spinner 1, III-V spinner
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| |-
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| |-style="background:WhiteSmoke; color:black"
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| |'''Developer'''
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| |ZED-N50/Hexyl Acetate,n-amyl acetate, oxylene. [[media:JJAP-51-06FC05.pdf|JJAP-51-06FC05.pdf]], [[media:JVB001037.pdf|JVB001037.pdf]]
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| |ZED-N500/Hexyl Acetate,n-amyl acetate, oxylene
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| |MIBK:IPA (1:3)/IPA:H2O
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| |AR600-55/MIBK:IPA
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| |X AR 600-54-6/MIBK:IPA
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| |TMAH/AZ400K:H2O
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| |Ma-D333/TMAH, MIF726
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| |mr. Dev
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| |-
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| |-style="background:LightGrey; color:black"
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| |'''Rinse'''
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| |IPA
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| |IPA
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| |IPA
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| |H2O
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| |H2O
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| |H2O
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| |-
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| |-style="background:WhiteSmoke; color:black"
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| |'''Remover'''
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| |acetone/1165
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| |acetone/1165
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| |acetone/1165/Pirahna
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| |acetone/1165
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| |acetone/O2 plasma
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| |-
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| |-style="background:LightGrey; color:black"
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| |'''Process Flow (docx-format)'''
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| |[[media:Process_Flow_ZEP.docx|Process_Flow_ZEP.docx]]
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| |Trilayer stack: [[media:Process_Flow_Trilayer_Ebeam_Resist.docx|Process_Flow_Trilayer_Ebeam_Resist.docx]]
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| |AA
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| |Trilayer stack: [[media:Process_Flow_Trilayer_Ebeam_Resist.docx|Process_Flow_Trilayer_Ebeam_Resist.docx]]
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| |[[media:Process_Flow_CSAR.docx|Process_Flow_CSAR.docx]]
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| |BB
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| |BB
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| |BB
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| |}
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| {|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" width="100%" | | {|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" width="100%" |
