Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions

Revision as of 13:44, 2 August 2013 view source Tigre (talk \| contribs) DCH-Employees-701 2,257 edits →Process Flows ← Older edit		Revision as of 13:45, 2 August 2013 view source Tigre (talk \| contribs) DCH-Employees-701 2,257 edits →Process Flows Newer edit →
Line 95:		Line 95:

	ZEP520A is used as a standard positive e-beam resist. A process flow for spinning, e-beam exposing and development of this resist can be downloaded here (word format):		ZEP520A is used as a standard positive e-beam resist. A process flow for spinning, e-beam exposing and development of this resist can be downloaded here (word format):
	[[media:Process_Flow_ZEP.docx\|Process_Flow_ZEP.docx]]; please note, that the individual steps of the process flow should be optimised to your specific processing technique, this process flow thus being a guideline.		[[media:Process_Flow_ZEP.docx\|Process_Flow_ZEP.docx]]; please note that the individual steps of the process flow should be optimised to your specific processing technique, this process flow thus being a guideline.