Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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= Getting started = | = Getting started = | ||
[[Image:ebeam load.jpg|400x400px|thumb|'''Only DTU Danchip personnel is allowed to load or unload cassettes to or from the machine''']] | [[Image:ebeam load.jpg|400x400px|thumb|'''Only DTU Danchip personnel is allowed to load or unload cassettes to or from the machine''']] | ||
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You can use the SSE-spinner, the Manual Spinner 1 or the III-V spinner to coat wafer or chips with e-beam resist. Read more about these spinners | You can use the SSE-spinner, the Manual Spinner 1 or the III-V spinner to coat wafer or chips with e-beam resist. Read more about these spinners | ||
<span class="plainlinks">[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters here]</span> (opens in a new tab). | <span class="plainlinks">[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters here]</span> (opens in a new tab). | ||
= Proximity Error Correction = | = Proximity Error Correction = | ||
* PEC in BEAMER | * PEC in BEAMER | ||
* trilayer flow, not tested | * trilayer flow, not tested | ||
= Charge dissipating agent = | = Charge dissipating agent = | ||
* Al coating, FLOW | * Al coating, FLOW | ||
* ESPACER, no flow yet | * ESPACER, no flow yet | ||