Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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===Process information=== | ===Process information=== | ||
'''HMDS priming:''' | |||
Contact bake. Vacuum bake. Prime. Pump-purge. Cool. | |||
10s contact bake at 50°C). 30s vacuum bake at ~0.5 bar. 72s HMDS priming using nitrogen carrier gas. 2 nitrogen pump-purge cycles. 5s cool. | |||
'''Spin coating:''' | |||
Dispence. Spin-of. EBR. BSR. | |||
'''Soft baking:''' | |||
Contact or proximity. Bake. Cool. | |||
'''Post-exposure baking:''' | |||
Contact or proximity. Bake. Cool. | |||
====HMDS priming only==== | ====HMDS priming only==== | ||
The standard HMDS priming process has been developed to mimic the behavior of the IMTEC Star2000 HMDS oven. | The standard HMDS priming process has been developed to mimic the behavior of the IMTEC Star2000 HMDS oven. | ||
It produces a contact angle of 81-82° on an oxidized silicon surface. | It produces a contact angle of 81-82° on an oxidized silicon surface. | ||
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''Flow names, process parameters, and test results:'' | ''Flow names, process parameters, and test results:'' | ||
*T1 T2 HMDS Standard | *T1 T2 HMDS Standard | ||
Process: 10s contact bake | Process: 10s contact bake, 30s vacuum bake, 72s HMDS priming. | ||
Tested ?/5 2013 on 100nm oxide: 81.4°. Tested ?/6 2013 on 3µm oxide: 81.8°. | Tested ?/5 2013 on 100nm oxide: 81.4°. Tested ?/6 2013 on 3µm oxide: 81.8°. | ||
====AZ MiR 701 (29cps) coating==== | ====AZ MiR 701 (29cps) coating==== | ||
Spin coating of AZ MiR 701 (29cps) on Spin Track 1 is divided into two or three steps: HMDS priming (optional), spin coating, and soft baking. At the moment, the HMDS priming is equal to the standard priming, but this may be subject to change as our process knowledge grows. Spin coating uses dynamic dispence of 4 ml resist at 800 rpm, followed by spin-of at a thickness dependent spin speed for a thickness dependent time. The wafer is deaccelerated at 1000 rpm/s for 5 seconds before stopping. Soft baking is done at 90°C for 60s. As MiR 701 has a tendency to produce "cotton candy" on the edges, soft baking is performed in 1 mm proximity. | Spin coating of AZ MiR 701 (29cps) on Spin Track 1 is divided into two or three steps: HMDS priming (optional), spin coating, and soft baking. At the moment, the HMDS priming is equal to the standard priming, but this may be subject to change as our process knowledge grows. Spin coating uses dynamic dispence of 4 ml resist at 800 rpm, followed by spin-of at a thickness dependent spin speed for a thickness dependent time. The wafer is deaccelerated at 1000 rpm/s for 5 seconds before stopping. Soft baking is done at 90°C for 60s. As MiR 701 has a tendency to produce "cotton candy" on the edges, soft baking is performed in 1 mm proximity. | ||