Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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''Flow names, process parameters, and test results:'' | ''Flow names, process parameters, and test results:'' | ||
*T1 T2 Standard | *T1 T2 HMDS Standard | ||
Process: 10s contact bake (at 50°C). 30s vacuum bake (~0.5 bar). 72s HMDS priming (nitrogen carrier gas). 2 nitrogen pump-purge cycles. | Process: 10s contact bake (at 50°C). 30s vacuum bake (~0.5 bar). 72s HMDS priming (nitrogen carrier gas). 2 nitrogen pump-purge cycles. | ||