Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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====AZ MiR 701 (29cps) coating==== | ====AZ MiR 701 (29cps) coating==== | ||
Spin coating of AZ MiR 701 (29cps) on Spin Track 1 is divided into two or three steps: HMDS priming (optional), spin coating, and soft baking. At the moment, the HMDS priming is equal to the standard priming, but this may be subject to change as our process knowledge grows. Spin coating uses dynamic dispence of 4 ml resist at 800 rpm, followed by spin-of at a thickness dependent spin speed for a thickness dependent time. The wafer is deaccelerated at 1000 rpm/s for 5 seconds before stopping. Soft baking is done at 90°C for 60s. As MiR 701 has a tendency to produce "cotton candy" on the edges, soft baking is performed in 1 mm proximity. | |||
*T1 MiR 701 1um no HMDS | |||
*T1 MiR 701 1um with HMDS | |||
Spin-of: 60 s at 9990 rpm. | |||
Tested ?? (with HMDS) on fresh silicon: ? µm. | |||
*T1 MiR 701 1,5um no HMDS | *T1 MiR 701 1,5um no HMDS | ||
*T1 MiR 701 1,5um with HMDS | *T1 MiR 701 1,5um with HMDS | ||
Spin-of: 30 s at 5000 rpm. | |||
Tested 18/6 2013 (with HMDS) on fresh silicon: 1.5? µm. | |||
*T1 MiR 701 2um no HMDS | *T1 MiR 701 2um no HMDS | ||
*T1 MiR 701 2um with HMDS | *T1 MiR 701 2um with HMDS | ||
Spin-of: 30 s at 9990 rpm. | |||
Tested ?? (with HMDS) on fresh silicon: ? µm. | |||
====AZ nLOF 2020 coating==== | ====AZ nLOF 2020 coating==== | ||