Jump to content

Specific Process Knowledge/Lithography/Coaters: Difference between revisions

← Older editNewer edit →
VisualWikitext
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,527 edits
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,527 edits
Line 142: Line 142:


The standard HMDS priming process has been developed to mimic the behavior of the IMTEC Star2000 HMDS oven.
The standard HMDS priming process has been developed to mimic the behavior of the IMTEC Star2000 HMDS oven.
It produces a contact angle of 81-82° on an oxidized silicon surface.


''Flow names, process parameters, and test results:''
*T1 T2 Standard
Process: 10s contact bake (at 50°C). 30s vacuum bake (~0.5 bar). 72s HMDS priming (nitrogen carrier gas). 2 nitrogen pump-purge cycles.
Process: 10s contact bake (at 50°C). 30s vacuum bake (~0.5 bar). 72s HMDS priming (nitrogen carrier gas). 2 nitrogen pump-purge cycles.


This process produces a contact angle of 81-82° on an oxidized silicon surface.
''Flow names and test results:''
*T1 T2 Standard
Tested ?/5 2013 on 100nm oxide: 81.4°. Tested ?/6 2013 on 3µm oxide: 81.8°.
Tested ?/5 2013 on 100nm oxide: 81.4°. Tested ?/6 2013 on 3µm oxide: 81.8°.


Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Coaters"