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*[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch|Nanoetch]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch|Nanoetch]]


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/slopedsidewalls|Etches that produce positively sloped sidewalls for imprinting purposes]]  
<!--  *[[Specific Process Knowledge/Etch/DRIE-Pegasus/slopedsidewalls|Etches that produce positively sloped sidewalls for imprinting purposes]] -->


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Waferthinning| Maskless reduction of wafer thicknesses]]
<!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/Waferthinning| Maskless reduction of wafer thicknesses]] -->
 
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/VeeryDeeep| Very deep etching]]


<!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/VeeryDeeep| Very deep etching]] -->


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
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