Specific Process Knowledge/Lithography/Coaters/SprayCoater: Difference between revisions

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Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Both tracks have a HMDS priming module, a spin coater, and a hotplate. In fack, the only difference between the two tracks is the resist used in the spin coating. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafets, but is currently set up for 100 mm wafer processing.
Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Both tracks have a HMDS priming module, a spin coater, and a hotplate. In fack, the only difference between the two tracks is the resist used in the spin coating. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafets, but is currently set up for 100 mm wafer processing.

Revision as of 08:33, 13 June 2013

Spray Coater

Spin Track 1 + 2 in Cleanroom 3
Equipment Spray Coater
Purpose
  • Spraying imprint resist
  • Spraying photoresist
  • Spraying of other solutions
Performance Substrate handling
  • Can handle almost any sample size and shape
Permanent media
  • No permanent media
Manual dispense option
  • Two syringe pumps
Process parameter range Solution viscosity
  • Range
Chemical properties
  • Must be non-toxic
  • Compatible with titanium
  • Resistant to ultrasonic atomization
Substrates Batch size
  • Any sample(s) that fit inside machine
Allowed materials
  • All chemicals to be spray coated must be approved specifically for spray coating
  • Any non-toxic, non-particulate and non-crosslinking material is likely to be approved


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Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Both tracks have a HMDS priming module, a spin coater, and a hotplate. In fack, the only difference between the two tracks is the resist used in the spin coating. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafets, but is currently set up for 100 mm wafer processing.

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager

Process information

Link to process pages - e.g. one page for each material

Example:

Equipment performance and process related parameters

Equipment Equipment 1 Equipment 2
Purpose
  • Purpose 1
  • Purpose 2
  • Purpose 1
  • Purpose 2
  • Purpose 3
Performance Response 1
  • Performance range 1
  • Performance range 2
  • Performance range 1
  • Performance range 2
  • Performance range 3
Response 2
  • Performance range
  • Performance range
Process parameter range Parameter 1
  • Range
  • Range
Parameter 2
  • Range
  • Range
Substrates Batch size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3