Specific Process Knowledge/Lithography/Coaters: Difference between revisions
| Line 124: | Line 124: | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*HMDS priming | *HMDS priming | ||
*Spin coating | *Spin coating and soft baking | ||
* | *Priming, coating, and baking | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*HMDS priming | *HMDS priming | ||
| Line 183: | Line 183: | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center" colspan="2"| | ||
100 mm wafers | 100 mm wafers | ||
|- | |- | ||
| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||