Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*HMDS priming | *HMDS priming | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | ||
|style="background:LightGrey; color:black"|Coating thickness | |style="background:LightGrey; color:black"|Coating thickness | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
1 - 3 µm | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
1.6 - 5 µm | |||
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|style="background:LightGrey; color:black"|HMDS contact angle | |style="background:LightGrey; color:black"|HMDS contact angle | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
~ 60 - 90° (SiO2) | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
~ 60 - 90° (SiO2) | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameters | !style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameters | ||
|style="background:LightGrey; color:black"|Spin speed | |style="background:LightGrey; color:black"|Spin speed | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
10 - 9990 rpm | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
10 - 9990 rpm | |||
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|style="background:LightGrey; color:black"|Spin acceleration | |style="background:LightGrey; color:black"|Spin acceleration | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
1000 - 50000 rpm/s | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
1000 - 50000 rpm/s | |||
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|style="background:LightGrey; color:black"|Hotplate temperature | |style="background:LightGrey; color:black"|Hotplate temperature | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
90°C | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
110°C | |||
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|style="background:LightGrey; color:black"|HMDS priming temperature | |style="background:LightGrey; color:black"|HMDS priming temperature | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
50°C | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
50°C | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
100 mm wafers | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
100 mm wafers | |||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||