Specific Process Knowledge/Lithography/Coaters: Difference between revisions
Appearance
| Line 135: | Line 135: | ||
|style="background:LightGrey; color:black"|Coating thickness | |style="background:LightGrey; color:black"|Coating thickness | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
1-3 µm | *1 - 3 µm | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
1.6-5 µm | *1.6 - 5 µm | ||
|- | |- | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|HMDS contact angle | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *~ 60 - 90° | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *~ 60 - 90° | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan=" | !style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameters | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Spin speed | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *10 - 9990 rpm | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *10 - 9990 rpm | ||
|- | |- | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Spin acceleration | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *1000 - 50000 rpm/s | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *1000 - 50000 rpm/s | ||
|- | |||
|style="background:LightGrey; color:black"|Hotplate temperature | |||
|style="background:WhiteSmoke; color:black"| | |||
*90°C | |||
|style="background:WhiteSmoke; color:black"| | |||
*110°C | |||
|- | |||
|style="background:LightGrey; color:black"|HMDS priming temperature | |||
|style="background:WhiteSmoke; color:black"| | |||
*50°C | |||
|style="background:WhiteSmoke; color:black"| | |||
*50°C | |||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *100 mm wafers | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *100 mm wafers | ||
|- | |- | ||
| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *Silicon | ||
* | *Glass | ||
|style="background:WhiteSmoke; color:black"| | |||
*Silicon | |||
*Glass | |||
|- | |||
|style="background:LightGrey; color:black"|Batch | |||
|style="background:WhiteSmoke; color:black"| | |||
*1 - 25 | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *1 - 25 | ||
|- | |- | ||
|} | |} | ||