Specific Process Knowledge/Lithography/Coaters/SprayCoater: Difference between revisions
No edit summary |
|||
Line 50: | Line 50: | ||
<br clear="all" /> | <br clear="all" /> | ||
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Track_1_.2B_2 click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Track_1_.2B_2 click here]''' |
Revision as of 14:02, 12 June 2013
Spray Coater
Equipment | Spray Coater | |
---|---|---|
Purpose |
| |
Performance | Substrate handling |
|
Permanent media |
| |
Manual dispense option |
| |
Process parameter range | Solution viscosity |
|
Chemical properties |
| |
Substrates | Batch size |
|
Allowed materials |
|
Feedback to this page: click here
Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Both tracks have a HMDS priming module, a spin coater, and a hotplate. In fack, the only difference between the two tracks is the resist used in the spin coating. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafets, but is currently set up for 100 mm wafer processing.
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager
Process information
Link to process pages - e.g. one page for each material
Example:
- Etch of silicon using RIE
- Etch of silicon oxide using RIE
- Etch of silicon nitride using RIE
- Etch of photo resist using RIE
Equipment | Equipment 1 | Equipment 2 | |
---|---|---|---|
Purpose |
|
| |
Performance | Response 1 |
|
|
Response 2 |
|
| |
Process parameter range | Parameter 1 |
|
|
Parameter 2 |
|
| |
Substrates | Batch size |
|
|
Allowed materials |
|
|