Specific Process Knowledge/Lithography/Coaters/SprayCoater: Difference between revisions

Revision as of 13:50, 12 June 2013

Spray Coater

Equipment		Spray Coater
Purpose		Spinning imprint resist Spinning photoresist Spinning of other solutions
Performance	Substrate handling	Can handle almost any sample size and shape
	Permanent media	No permanent media
	Manual dispense option	Two syringe pumps
Process parameter range	Solution viscosity	Range
Process parameter range	Chemical properties	Must be non-toxic Compatible with titanium
Substrates	Batch size	Any sample(s) that fit inside machine
	Allowed materials	All chemicals to be spray coated must be approved specifically for spray coating Any non-toxic, non-particulate and non-crosslinking material is likely to be approved

Spin Track 1 + 2

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Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Both tracks have a HMDS priming module, a spin coater, and a hotplate. In fack, the only difference between the two tracks is the resist used in the spin coating. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafets, but is currently set up for 100 mm wafer processing.

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager

Process information

Link to process pages - e.g. one page for each material

Example:

Equipment performance and process related parameters

Equipment		Equipment 1	Equipment 2
Purpose		Purpose 1 Purpose 2	Purpose 1 Purpose 2 Purpose 3
Performance	Response 1	Performance range 1 Performance range 2	Performance range 1 Performance range 2 Performance range 3
Performance	Response 2	Performance range	Performance range
Process parameter range	Parameter 1	Range	Range
Process parameter range	Parameter 2	Range	Range
Substrates	Batch size	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers
	Allowed materials	Allowed material 1 Allowed material 2	Allowed material 1 Allowed material 2 Allowed material 3

@@ Line 4: / Line 4: @@
 !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
-|style="background:WhiteSmoke; color:black"|<b>SSE Spinner</b>
+|style="background:WhiteSmoke; color:black"|<b>Spray Coater</b>
-|style="background:WhiteSmoke; color:black"|<b>KS Spinner</b>
 |-
 !style="background:silver; color:black;" align="center"|Purpose
 |style="background:LightGrey; color:black"|
 |style="background:WhiteSmoke; color:black"|
-*Spinning and baking of AZ2514E resist
+*Spinning imprint resist
-*Spinning and baking of AZ4562 resist
+*Spinning photoresist
-*Spinning and baking of e-beam resist
+*Spinning of other solutions
-|style="background:WhiteSmoke; color:black"|
-*Spinning and baking of AZ2514E resist
-*Spinning and baking of AZ4562 resist
-*Spinning and baking of SU8 resist
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
 |style="background:LightGrey; color:black"|Substrate handling
 |style="background:WhiteSmoke; color:black"|
-* Cassette-to-cassette
+* Can handle almost any sample size and shape
-* Edge handling chuck
-|style="background:WhiteSmoke; color:black"|
-* Single substrate
-* Non-vacuum chuck for fragile substrates
 |-
 |style="background:LightGrey; color:black"|Permanent media
 |style="background:WhiteSmoke; color:black"|
-* AZ5214E resist
+* No permanent media
-* AZ4562 resist
-* Acetone for chuck cleaning
-* Acetone for drip pan
-|style="background:WhiteSmoke; color:black"|
-* AZ5214E resist
-* PGMEA for edge bead removal
-* Acetone for chuck cleaning
 |-
 |style="background:LightGrey; color:black"|Manual dispense option
 |style="background:WhiteSmoke; color:black"|
-* 2 automatic syringes
+* Two syringe pumps
-|style="background:WhiteSmoke; color:black"|
-* yes
-* pneumatic dispense for SU8 resist
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
-|style="background:LightGrey; color:black"|Parameter 1
+|style="background:LightGrey; color:black"|Solution viscosity
-|style="background:WhiteSmoke; color:black"|
-*Range
 |style="background:WhiteSmoke; color:black"|
 *Range
 |-
-|style="background:LightGrey; color:black"|Parameter 2
+|style="background:LightGrey; color:black"|Chemical properties
-|style="background:WhiteSmoke; color:black"|
-*Range
 |style="background:WhiteSmoke; color:black"|
-*Range
+*Must be non-toxic
+*Compatible with titanium
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
 |style="background:LightGrey; color:black"|Batch size
 |style="background:WhiteSmoke; color:black"|
-*<nowiki>24</nowiki> 50 mm wafers
+*Any sample(s) that fit inside machine
-*<nowiki>24</nowiki> 100 mm wafers
-*<nowiki>24</nowiki> 150 mm wafers
-|style="background:WhiteSmoke; color:black"|
-*<nowiki>1</nowiki> 100 mm wafers
-*<nowiki>1</nowiki> 150 mm wafers
 |-
 | style="background:LightGrey; color:black"|Allowed materials
 |style="background:WhiteSmoke; color:black"|
-*Allowed material 1
+*All chemicals to be spray coated must be approved specifically for spray coating
-*Allowed material 2
+*Any non-toxic, non-particulate and non-crosslinking material is likely to be approved
-|style="background:WhiteSmoke; color:black"|
-*Allowed material 1
-*Allowed material 2
-*Allowed material 3
 |-
 |}