Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Both tracks have a HMDS priming module, a spin coater, and a hotplate. In fack, the only difference between the two tracks is the resist used in the spin coating. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafets, but is currently set up for 100 mm wafer processing. | |||
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:''' | '''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:''' |
Revision as of 13:27, 12 June 2013
Coaters: Comparison Table
Equipment | SSE Spinner | KS Spinner | |
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Purpose |
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Performance | Substrate handling |
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Permanent media |
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Manual dispense option |
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Process parameter range | Parameter 1 |
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Parameter 2 |
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Substrates | Batch size |
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Allowed materials |
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SSE Spinner
The SSE spinner MAXIMUS: positioned in Cleanroom 13.
SSE Spinner, Maximus 804, SSE Sister Semiconductor Equipment is a resist spinning system at Danchip which can be used for spinning on 2", 4" and 6" substrates.
The system is equipped with 2 different resists lines:
- AZ5214E and
- AZ4562 and
- 2 syringe lines, which can be used for spinning of e-beam resist.
The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager: Equipment info in LabManager
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Spin Track 1 + 2
Feedback to this page: click here
Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Both tracks have a HMDS priming module, a spin coater, and a hotplate. In fack, the only difference between the two tracks is the resist used in the spin coating. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafets, but is currently set up for 100 mm wafer processing.
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
Process information
Link to process pages - e.g. one page for each material
Example:
- Etch of silicon using RIE
- Etch of silicon oxide using RIE
- Etch of silicon nitride using RIE
- Etch of photo resist using RIE
Equipment | Equipment 1 | Equipment 2 | |
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Purpose |
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Performance | Response 1 |
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Response 2 |
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Process parameter range | Parameter 1 |
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Parameter 2 |
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Substrates | Batch size |
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Allowed materials |
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KS Spinner
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Manual Spinner 1 (Laurell)
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