Specific Process Knowledge/Lithography/Coaters: Difference between revisions

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==Spin Track 1 + 2==
==Spin Track 1 + 2==


'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/... click here]'''
<!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page-->


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=== Name of equipment ===
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Write a short description of the equipment(s).  
 
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
<!-- remember to remove the type of documents that are not present -->
 
[[image:Cluster1.jpg|200x200px|right|thumb|Image(s) of the equipment(s)]]
 
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=316 LabManager]
 
=== Process information ===
 
Link to process pages - e.g. one page for each material
 
Example:
*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Etch of silicon using RIE]]
*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]]
*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]]
*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of photo resist using RIE]]
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>Equipment 1</b>
|style="background:WhiteSmoke; color:black"|<b>Equipment 2</b>
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Purpose 1
*Purpose 2
|style="background:WhiteSmoke; color:black"|
*Purpose 1
*Purpose 2
*Purpose 3
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Response 1
|style="background:WhiteSmoke; color:black"|
*Performance range 1
*Performance range 2
|style="background:WhiteSmoke; color:black"|
*Performance range 1
*Performance range 2
*Performance range 3
|-
|style="background:LightGrey; color:black"|Response 2
|style="background:WhiteSmoke; color:black"|
*Performance range
|style="background:WhiteSmoke; color:black"|
*Performance range
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Parameter 1
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|-
|style="background:LightGrey; color:black"|Parameter 2
|style="background:WhiteSmoke; color:black"|
*Range
|style="background:WhiteSmoke; color:black"|
*Range
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
|style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*Allowed material 2
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*Allowed material 2
*Allowed material 3
|-
|}
 
<br clear="all" />


==KS Spinner==
==KS Spinner==

Revision as of 12:56, 12 June 2013

Coaters: Comparison Table

Equipment SSE Spinner KS Spinner
Purpose
  • Spinning and baking of AZ2514E resist
  • Spinning and baking of AZ4562 resist
  • Spinning and baking of e-beam resist
  • Spinning and baking of AZ2514E resist
  • Spinning and baking of AZ4562 resist
  • Spinning and baking of SU8 resist
Performance Substrate handling
  • Cassette-to-cassette
  • Edge handling chuck
  • Single substrate
  • Non-vacuum chuck for fragile substrates
Permanent media
  • AZ5214E resist
  • AZ4562 resist
  • Acetone for chuck cleaning
  • Acetone for drip pan
  • AZ5214E resist
  • PGMEA for edge bead removal
  • Acetone for chuck cleaning
Manual dispense option
  • 2 automatic syringes
  • yes
  • pneumatic dispense for SU8 resist
Process parameter range Parameter 1
  • Range
  • Range
Parameter 2
  • Range
  • Range
Substrates Batch size
  • 24 50 mm wafers
  • 24 100 mm wafers
  • 24 150 mm wafers
  • 1 100 mm wafers
  • 1 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3


SSE Spinner

The SSE spinner MAXIMUS: positioned in Cleanroom 13.


The SSE spinner MAXIMUS: positioned in Cleanroom 13. SSE Spinner, Maximus 804, SSE Sister Semiconductor Equipment is a resist spinning system at Danchip which can be used for spinning on 2", 4" and 6" substrates.

The system is equipped with 2 different resists lines:

  • AZ5214E and
  • AZ4562 and
  • 2 syringe lines, which can be used for spinning of e-beam resist.

The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager: Equipment info in LabManager

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Spin Track 1 + 2

Feedback to this page: click here

Name of equipment

Write a short description of the equipment(s).

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

File:Cluster1.jpg
Image(s) of the equipment(s)

LabManager

Process information

Link to process pages - e.g. one page for each material

Example:

Equipment performance and process related parameters

Equipment Equipment 1 Equipment 2
Purpose
  • Purpose 1
  • Purpose 2
  • Purpose 1
  • Purpose 2
  • Purpose 3
Performance Response 1
  • Performance range 1
  • Performance range 2
  • Performance range 1
  • Performance range 2
  • Performance range 3
Response 2
  • Performance range
  • Performance range
Process parameter range Parameter 1
  • Range
  • Range
Parameter 2
  • Range
  • Range
Substrates Batch size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3


KS Spinner

The KS spinner is placed in Cleanroom 3.

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Manual Spinner 1 (Laurell)

The Manual Spinner(Polymers) is placed in fumehood in Cleanroom 3.

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