Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions
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|style="background:LightGrey; color:black"|pH | |style="background:LightGrey; color:black"|pH | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
3,5 - 4,0 | 3,5 - 4,0 (3,5 - 3,8 recommended by manufacturer) | ||
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*<nowiki>#</nowiki> 1 x 100 mm wafer | *<nowiki>#</nowiki> 1 x 100 mm wafer | ||
*<nowiki>#</nowiki> 1 x 150 mm wafer | *<nowiki>#</nowiki> 1 x 150 mm wafer | ||
*Maximum sample thickness: 1,0 mm | |||
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