Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions
Appearance
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | ||
|style="background:WhiteSmoke; color:black"|<b> | |style="background:WhiteSmoke; color:black"|<b>Electroplating-Ni</b> | ||
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!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
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Electrochemical deposition of nickel | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Thickness | ||
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0 - 1400 µm | |||
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|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Uniformity | ||
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Around 10% (depending on sample and process) | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|Temperature | ||
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* | 52*C | ||
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|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"|pH | ||
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3,5 - 4,0 | |||
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|style="background:LightGrey; color:black"|Batch size | |style="background:LightGrey; color:black"|Batch size | ||
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*<nowiki>#</nowiki> | *<nowiki>#</nowiki> 1 x 50 mm wafer | ||
*<nowiki>#</nowiki> 1 x 100 mm wafer | |||
*<nowiki>#</nowiki> 100 mm | *<nowiki>#</nowiki> 1 x 150 mm wafer | ||
*<nowiki>#</nowiki> 150 mm | |||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
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Most materials '''except copper and cobalt'''. | |||
* | *Ask Danchip for details. | ||
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