Specific Process Knowledge/Etch/Wet Gold Etch: Difference between revisions
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Etch of pure Gold (as stripper). | Etch of pure Gold (as stripper). | ||
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!Link to safety APV and KBA | |||
|[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here]. | |||
[http://kemibrug.dk/KBA/CAS/107388/?show_KBA=1&portaldesign=1 see KBA here] | |||
|[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here] | |||
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|-style="background: | |-style="background:WhiteSmoke; color:black" | ||
!Chemical solution | !Chemical solution | ||
|KI:I<sub>2</sub>:H<sub>2</sub>O (100g:25g:500ml) | |KI:I<sub>2</sub>:H<sub>2</sub>O (100g:25g:500ml) | ||
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|-style="background: | |-style="background:LightGrey; color:black" | ||
!Process temperature | !Process temperature | ||
|20 <sup>o</sup>C | |20 <sup>o</sup>C | ||
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!Possible masking materials | !Possible masking materials | ||
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|-style="background: | |-style="background:LightGrey; color:black" | ||
!Etch rate | !Etch rate | ||
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!Batch size | !Batch size | ||
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|-style="background: | |-style="background:LightGrey; color:black" | ||
!Size of substrate | !Size of substrate | ||
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