Specific Process Knowledge/Etch/Wet Gold Etch: Difference between revisions

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Etch of pure Gold (as stripper).
Etch of pure Gold (as stripper).
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!Link to safety APV and KBA
|[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here].
[http://kemibrug.dk/KBA/CAS/107388/?show_KBA=1&portaldesign=1 see KBA here]
|[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here]
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!Chemical solution
!Chemical solution
|KI:I<sub>2</sub>:H<sub>2</sub>O  (100g:25g:500ml)
|KI:I<sub>2</sub>:H<sub>2</sub>O  (100g:25g:500ml)
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!Process temperature
!Process temperature
|20 <sup>o</sup>C
|20 <sup>o</sup>C
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!Possible masking materials
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!Etch rate
!Etch rate
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!Batch size
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!Size of substrate
!Size of substrate
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Revision as of 11:00, 3 June 2013

Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with IBE by sputtering with Ar ions.


Etching of Gold

Wet Gold Etch: Done in the fumehood positioned in cleanroom 2

Etching of Gold is done wet at Danchip making your own set up in a beaker in the fumehood. You can see the APV here.

We have two different solutions:

  1. Iodine etch: KI:I2:H2O - 100g:25g:500ml - standard at Danchip. Can be used with AZ resist as mask.
  2. Aqua Regia (Kongevand): HNO3:HCl - 1:3 - A very strong acid witch will etch most metals and are therefore used when you wish to remove all the gold from your wafer. you have to be very carefull when you work with Aqua Regia (Kongevand) It can generate nitrous gases witch are very toxic!!


Comparing the two solutions

Iodine based gold etch Aqua Regia (Kongevand)
General description

Etch of pure Gold with or without photoresist mask.

Etch of pure Gold (as stripper).

Link to safety APV and KBA see APV here.

see KBA here

see APV here
Chemical solution KI:I2:H2O (100g:25g:500ml) HCl:HNO3 (3:1)
Process temperature 20 oC 20 oC
Possible masking materials

Photoresist (1.5 µm AZ5214E)

Unmasked - used as a stripper

Etch rate

~100 nm/min

~(??) nm/min - fast etch

Batch size

1-5 4" wafers at a time

1-5 4" wafer at a time

Size of substrate

2-6" wafers

2-6" wafers