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Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420: Difference between revisions

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==Overview of the performance of the Surfscan 6420 and some process related parameters==
==Overview of the performance of the Surfscan 6420 and some process related parameters==


{| border="2" cellspacing="0" cellpadding="0"  
{| border="2" cellspacing="0" cellpadding="2"  
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!style="background:silver; color:black;" align="center"|Purpose  
!style="background:silver; color:black;" align="center"|Purpose  
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Particles counting
*Detecting, counting and sizing of particles (light point defects)
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!style="background:silver; color:black" align="center" rowspan="3"|Performance
!style="background:silver; color:black" align="center" rowspan="3"|Performance
|style="background:LightGrey; color:black"|Particles size
|style="background:LightGrey; color:black"|Particles size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*0.1 µm to 3 µm
*0.15 µm to 3 µm
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|style="background:LightGrey; color:black"|Througput
|style="background:LightGrey; color:black"|Througput
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|style="background:LightGrey; color:black"|Repeatbility
|style="background:LightGrey; color:black"|Repeatbility
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Within  1%, 1σ (mean count > 500, 0,204 µm diameter latex spheres)
*Within  1%, 1σ (mean count > 500, 0.204 µm diameter latex spheres)
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Process parameter range
|style="background:LightGrey; color:black"|Process Temperature
|style="background:LightGrey; color:black"|Process Temperature
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|style="background:WhiteSmoke; color:black"|
*Room temperature
*Room temperature
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|style="background:LightGrey; color:black"|Process pressure
|style="background:WhiteSmoke; color:black"|
*1 atm
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Small wafer pieces can all be used
*1-25 100 mm wafers  
*1-25 100 mm wafers  
*1-25 150 mm wafers
*1-25 150 mm wafers
*1-25 200 mm wafers
*1-25 200 mm wafers (loader has to be changed)
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|-
| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
 
*Silicon
*Thin layers of oxide, nitride and polymer/resist
|-  
|-  
|}
|}
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