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Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420: Difference between revisions

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==Overview of the performance of the Surfscan 6420 and some process related parameters==
==Overview of the performance of the Surfscan 6420 and some process related parameters==


{| border="2" cellspacing="0" cellpadding="0"  
{| border="2" cellspacing="0" cellpadding="2"  
|-
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!style="background:silver; color:black;" align="center"|Purpose  
!style="background:silver; color:black;" align="center"|Purpose  
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Particles counting
*Detecting, counting and sizing of particles (light point defects)
|-
|-
!style="background:silver; color:black" align="center" rowspan="3"|Performance
!style="background:silver; color:black" align="center" rowspan="3"|Performance
|style="background:LightGrey; color:black"|Particles size
|style="background:LightGrey; color:black"|Particles size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*0.1 µm to 3 µm
*0.15 µm to 3 µm
|-
|-
|style="background:LightGrey; color:black"|Througput
|style="background:LightGrey; color:black"|Througput
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|style="background:LightGrey; color:black"|Repeatbility
|style="background:LightGrey; color:black"|Repeatbility
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Within  1%, 1σ (mean count > 500, 0,204 µm diameter latex spheres)
*Within  1%, 1σ (mean count > 500, 0.204 µm diameter latex spheres)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Process parameter range
|style="background:LightGrey; color:black"|Process Temperature
|style="background:LightGrey; color:black"|Process Temperature
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Room temperature
*Room temperature
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|style="background:LightGrey; color:black"|Process pressure
|style="background:WhiteSmoke; color:black"|
*1 atm
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|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Small wafer pieces can all be used
*1-25 100 mm wafers  
*1-25 100 mm wafers  
*1-25 150 mm wafers
*1-25 150 mm wafers
*1-25 200 mm wafers
*1-25 200 mm wafers (loader has to be changed)
|-
|-
| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
 
*Silicon
*Thin layers of oxide, nitride and polymer/resist
|-  
|-  
|}
|}

Revision as of 10:20, 3 June 2013

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KLA-Tencor Surfscan 6420

The image is from the cleanroom at the place it was refurbish in California.

Particle counting of an unpatterned surface. A broad range of particles size from 0.15 µm to greater than 3 µm can be measured on a polished silicon or epitaxial layers. Thin films like Nitride and thermal Oxide can also be inspected. The system will remove small surface roughness so it will not count as particles.



Overview of the performance of the Surfscan 6420 and some process related parameters

Purpose
  • Detecting, counting and sizing of particles (light point defects)
Performance Particles size
  • 0.15 µm to 3 µm
Througput
  • Up to 100 wafer per hour (200 mm)
Repeatbility
  • Within 1%, 1σ (mean count > 500, 0.204 µm diameter latex spheres)
Process parameter range Process Temperature
  • Room temperature
Substrates Batch size
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
  • 1-25 200 mm wafers (loader has to be changed)
Substrate materials allowed
  • Silicon
  • Thin layers of oxide, nitride and polymer/resist
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