Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch): Difference between revisions
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The shallolr recipe is designed to etch features (with sizes above 1 <math>\mu</math>m) in silicon down to a depth that ranges from a few microns to some 50 microns. If you need to etch deeper use Deepetch or more shallow, see Nanoetches. | The shallolr recipe is designed to etch features (with sizes above 1 <math>\mu</math>m) in silicon down to a depth that ranges from a few microns to some 50 microns. If you need to etch deeper use Deepetch or more shallow, see Nanoetches. | ||
The recipe is given below. | |||
The recipe is given below. | |||
{| border="2" cellpadding="2" cellspacing="1" align="left" | {| border="2" cellpadding="2" cellspacing="1" align="left" | ||
|+ The shallolr recipe | |+ The shallolr recipe | ||
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| 5 s | | 5 s | ||
|} | |} | ||
The process runs for 31 cycles (5:56 mins). The fact that it's Bosch process is clear from the scallops on the sidewalls - one should be able to count 31 of them. | |||
The process is designed to reach 20 <math>\mu</math>m down in a 2 <math>\mu</math>m trench but as is clear from the image of the corresponding 50 <math>\mu</math>m trench, this one is etched deeper. | |||
[[image:jmlshal070921 pos1 2mu_09.jpg|370x370px|thumb|left|Standardization image of the profile of a 2 <math>\mu</math>m trench created by the shallolr recipe]] | |||
[[image:jmlshal070921 pos1 50mu_08.jpg|370x370px|thumb|right|Standardization image of the profile of a 50 <math>\mu</math>m trench created by the shallolr recipe]] | |||