Specific Process Knowledge/Etch/Wet Chromium Etch: Difference between revisions
Appearance
No edit summary |
|||
| Line 21: | Line 21: | ||
===Overview of the data for the chromium etches=== | ===Overview of the data for the chromium etches=== | ||
{| border="1" cellspacing=" | {|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" | ||
|- | |||
|- | |||
|-style="background:silver; color:black" | |||
! Chromium etch 1 | ! Chromium etch 1 | ||
! Chromium etch 2 | ! Chromium etch 2 | ||
|- | |- | ||
| | |||
|-style="background:WhiteSmoke; color:black" | |||
!General description | |||
| | | | ||
Etch of chromium | Etch of chromium | ||
| Line 32: | Line 37: | ||
Etch of chromium | Etch of chromium | ||
|- | |- | ||
| | |||
|-style="background:LightGrey; color:black" | |||
!Link to safety APV and KBA | |||
|[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here]. | |[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here]. | ||
[http://kemibrug.dk/KBA/CAS/107388/?show_KBA=1&portaldesign=1 see KBA here] | [http://kemibrug.dk/KBA/CAS/107388/?show_KBA=1&portaldesign=1 see KBA here] | ||
|[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here] | |[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here] | ||
|- | |- | ||
| | |||
|-style="background:WhiteSmoke; color:black" | |||
!Chemical solution | |||
|Chrome Etch 18 | |Chrome Etch 18 | ||
|HNO<sub>3</sub>:H<sub>2</sub>O:cerisulphate - 90ml:1200ml:15g | |HNO<sub>3</sub>:H<sub>2</sub>O:cerisulphate - 90ml:1200ml:15g | ||
|- | |- | ||
| | |||
|-style="background:LightGrey; color:black" | |||
!Process temperature | |||
|Room temperature | |Room temperature | ||
| Line 48: | Line 59: | ||
|- | |- | ||
| | |-style="background:WhiteSmoke; color:black" | ||
!Possible masking materials | |||
|Photoresist (1.5 µm AZ5214E) | |Photoresist (1.5 µm AZ5214E) | ||
|Photoresist (1.5 µm AZ5214E) | |Photoresist (1.5 µm AZ5214E) | ||
|- | |- | ||
| | |||
|-style="background:LightGrey; color:black" | |||
!Etch rate | |||
|~ ? nm/min | |~ ? nm/min | ||
|~40-100 nm/min | |~40-100 nm/min | ||
|- | |- | ||
| | |||
|-style="background:WhiteSmoke; color:black" | |||
!Batch size | |||
|1-7 wafers at a time | |1-7 wafers at a time | ||
|1-7 wafers at a time | |1-7 wafers at a time | ||
|- | |- | ||
| | |||
|-style="background:LightGrey; color:black" | |||
!Size of substrate | |||
|4" wafers | |4" wafers | ||
|4" wafers | |4" wafers | ||
|- | |- | ||
| | |||
|-style="background:WhiteSmoke; color:black" | |||
!Allowed materials | |||
|No restrictions. | |No restrictions. | ||
Make a note on the beaker of which materials have been processed. | Make a note on the beaker of which materials have been processed. | ||