Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride/Deposition of Silicon Nitride using PECVD: Difference between revisions
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===Expected results=== | |||
{| border="1" cellspacing="0" cellpadding="5" | |||
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|Recipe name | |||
|Deposition rate [nm/min] | |||
|RI | |||
|Uniformity [%] | |||
|Stress [MPa] | |||
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|1nitride | |||
|~32 | |||
|1.89 | |||
|0.4 | |||
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