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Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide/SiO2 disk and granule source tests in Temescal October 2026: Difference between revisions

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'''Note.''' This report records exploratory tests rather than an operating instruction. Source coverage must be assessed during deposition; the absence of damage in one run does not establish that continued operation after breakthrough is acceptable. Use the current local operating procedures and tool-responsible guidance [2, 3].
'''Note.''' This report records exploratory tests rather than an operating instruction. Source coverage must be assessed during deposition; the absence of damage in one run does not establish that continued operation after breakthrough is acceptable. Use the current local operating procedures and tool-responsible guidance [2, 3].


== Experimental record and scope ==
=== Experimental record ===
[1] Evgeniy Shkondin, DTU Nanolab. Temescal SiO<sub>2</sub> source tests, 22-23 October 2026: experimental observations, source photographs and schematics, Cauchy-model ellipsometry results and source-mass measurements. Rikke M. Nielsen was present during Run 1; Run 2 was carried out by Evgeniy Shkondin alone.
[4] “2610229.dlg”: Run 1 instrument recording, 22 October 2026. [5] “2610234.dlg”: Run 2 instrument recording, 23 October 2026. Their dates and 6.000 kÅ / 1.0 Å/s settings match the tests. The power and rate curves are reconstructed from these files.
[6] Source-material package labels: ScoTech silicon dioxide disks, 21 mm diameter × 5 mm thick, 99.99% (4N), tracking number 2702/SiO2; Umicore Thin Film Products AG silicon dioxide granulate, 1.5-3.5 mm, 99.99%, product code 0481889. Photographs of both labels accompany the report package.
=== Setup and observation record ===
A HULA (high uniformity lift-off assembly) holder was used in both runs. The SiO<sub>2</sub> film thicknesses were obtained by Cauchy-model ellipsometry. Figure 5 records visual mental descriptions through the top chamber window, where brightness, contrast and shadowing affect interpretation. Final penetration depths were established after venting.


=== Related local documentation ===
=== Related local documentation ===


[2] DTU Nanolab LabAdviser, “Temescal processing / Good to know about the Temescal”. QCM conversion, tooling calibration and source monitoring. Accessed 27 October 2026.
[1] DTU Nanolab LabAdviser, “Temescal processing / Good to know about the Temescal”. QCM conversion, tooling calibration and source monitoring. Accessed 27 October 2026.


[https://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Temescal/Good_to_know_about_the_Temescal Open the Temescal process-control guide]
[https://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Temescal/Good_to_know_about_the_Temescal Open the Temescal process-control guide]


[3] DTU Nanolab LabAdviser, “Evaporation of SiO<sub>2</sub> in Temescal-2”. Related local process information, accessed 27 October 2026. Its earlier tests are separate from this comparison.
[2] DTU Nanolab LabAdviser, “Evaporation of SiO<sub>2</sub> in Temescal-2”. Related local process information, accessed 27 October 2026. Its earlier tests are separate from this comparison.


[https://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Silicon_Oxide/Deposition_of_SiO2_in_E-Beam_Evaporator_Temescal-2 Open the related SiO<sub>2</sub> deposition page]
[https://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Silicon_Oxide/Deposition_of_SiO2_in_E-Beam_Evaporator_Temescal-2 Open the related SiO<sub>2</sub> deposition page]
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