Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide/SiO2 disk and granule source tests in Temescal October 2026: Difference between revisions
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No smoothing, outlier removal or thickness rescaling is applied to the remaining points. Original record order and small reversals in the thickness indication are preserved. The package includes the unfiltered wall-clock plots and all records. Cumulative deposition-phase time is about 101.33 min for Run 1 and 99.87 min for Run 2; the separate shutter-open counters are each 3 s shorter. | No smoothing, outlier removal or thickness rescaling is applied to the remaining points. Original record order and small reversals in the thickness indication are preserved. The package includes the unfiltered wall-clock plots and all records. Cumulative deposition-phase time is about 101.33 min for Run 1 and 99.87 min for Run 2; the separate shutter-open counters are each 3 s shorter. | ||
== Conclusions | == Conclusions == | ||
=== Conclusions supported by this comparison === | === Conclusions supported by this comparison === | ||
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The strongest evidence supports improved deposition stability and reduced penetration depth in Run 2. Lower mass consumption was not quantified because the second charge was not weighed before and after deposition. A reliable maximum thickness requires further testing. | The strongest evidence supports improved deposition stability and reduced penetration depth in Run 2. Lower mass consumption was not quantified because the second charge was not weighed before and after deposition. A reliable maximum thickness requires further testing. | ||
'''Note.''' This report records exploratory tests rather than an operating instruction. Source coverage must be assessed during deposition; the absence of damage in one run does not establish that continued operation after breakthrough is acceptable. Use the current local operating procedures and tool-responsible guidance [2, 3]. | '''Note.''' This report records exploratory tests rather than an operating instruction. Source coverage must be assessed during deposition; the absence of damage in one run does not establish that continued operation after breakthrough is acceptable. Use the current local operating procedures and tool-responsible guidance [2, 3]. | ||