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Specific Process Knowledge/Thin film deposition/Deposition of Tungsten/Sputtering of W in Sputter Coater 3: Difference between revisions

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'''Feedback to this page''': '''[mailto:pvd@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Tungsten/Sputtering_of_W_in_Sputter_Coater_3&action=edit click here]'''  
'''Feedback to this page''': '''[mailto:pvd@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Tungsten/Sputtering_of_W_in_Sputter_Coater_3&action=edit click here]'''  
<i>This page is written by <b>Evgeniy Shkondin @DTU Nanolab</b> if nothing else is stated. <br>
All images and photos on this page belongs to <b>DTU Nanolab</b>.<br>
The fabrication and characterization described below were conducted in <b>2022 by Evgeniy Shkondin, DTU Nanolab</b>.<br></i>


[[Specific_Process_Knowledge/Thin_film_deposition/Sputter_coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] is mainly used for sample preparation before [[Specific_Process_Knowledge/Characterization/SEM: Scanning Electron Microscopy|SEM inspection]]. Usually, [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold|Au]] is sputtered on dielectric surfaces to compensate for charge build-up. Alternatively, many other materials can be sputtered if the setup allows (you need to have a turbo pump and Ar gas). Gold can be deposited even in pure oxygen plasma and only with roughing pumps. Fortunately, Sputter Coater 3 located in the basement of building 346, has both a turbo pump and an Ar working gas source. The pressure during the process is measured to be below 0.1 mBar. This page describes deposition of tungsten (W) with this instrument.
[[Specific_Process_Knowledge/Thin_film_deposition/Sputter_coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] is mainly used for sample preparation before [[Specific_Process_Knowledge/Characterization/SEM: Scanning Electron Microscopy|SEM inspection]]. Usually, [[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold|Au]] is sputtered on dielectric surfaces to compensate for charge build-up. Alternatively, many other materials can be sputtered if the setup allows (you need to have a turbo pump and Ar gas). Gold can be deposited even in pure oxygen plasma and only with roughing pumps. Fortunately, Sputter Coater 3 located in the basement of building 346, has both a turbo pump and an Ar working gas source. The pressure during the process is measured to be below 0.1 mBar. This page describes deposition of tungsten (W) with this instrument.


The fabrication and characterization described below were conducted in <b>2022 by Evgeniy Shkondin, DTU Nanolab</b>. The prepared samples were investigated by the [[Specific Process Knowledge/Characterization/XRD/XRD_SmartLab|X-ray Reflectivity (XRR)]], [[Specific_Process_Knowledge/Characterization/SEM: Scanning Electron Microscopy|Scanning Electron Microscopy (SEM)]] and [[Specific Process Knowledge/Characterization/XPS|Photo Electron Spectroscopy (XPS) methods]]. The focus of the study was the deposition conditions.
The prepared samples were investigated by the [[Specific Process Knowledge/Characterization/XRD/XRD_SmartLab|X-ray Reflectivity (XRR)]], [[Specific_Process_Knowledge/Characterization/SEM: Scanning Electron Microscopy|Scanning Electron Microscopy (SEM)]] and [[Specific Process Knowledge/Characterization/XPS|Photo Electron Spectroscopy (XPS) methods]]. The focus of the study was the deposition conditions.




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