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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Storage_and_cleaning_of_wafer_to_the_A,_B,_C_and_E_stack_furnaces click here]'''  
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==RCA cleaning of wafers for the A, B, C and E stack furnaces==
==RCA cleaning of wafers for the A, B, C and E stack furnaces==
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====C4 furnace:====
====C4 furnace:====
*For annealing of wafers and wafer pieces with Al, Al2O3 and TiO2. The samples cannot be RCA cleaned.  
*For annealing of wafers and wafer pieces with Al, Al2O3 and TiO2. The samples cannot be RCA cleaned.  
====E1 furnace:====
*New silicon wafers can go directly into the furnace.
*Other processed wafers and new quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace.




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