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Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions

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== Sputter-System Metal-Nitride(PC3) ==
== Sputter-System Metal-Nitride (PC3) ==


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The second process chamber called PC3 consists of two KJLC Torus® 3" magnetron sputtering sources and one height adjustable KJLC Torus® 4" magnetron sputtering source, also with possibility of RF, DC, Pulse DC and HIPIMS sputtering. The chamber has a possibility to do the RF bias on a substrate, which can be used as substrate cleaning before the deposition or used during the deposition to alter the film properties.
 
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<gallery caption="Deposition rates of HfO2 at different temperaturs. ALD window." widths="600px" heights="600px" perrow="2">
<gallery caption="Deposition rates of HfO2 at different temperaturs. ALD window." widths="600px" heights="600px" perrow="2">
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